Comtech Xicom Technology Announces New High Power, High Efficiency and Very-Low Leakage X-band SSPAs and BUCs

May 2, 2019– Comtech Xicom Technology, Inc., a subsidiary
within Comtech Telecommunications Corp.’s (NASDAQ: CMTL) Commercial
Solutions segment, announced today a new series of industry-leading
X-band solid-state power amplifiers (“SSPAs”) and block upconverters

The XTSLIN-25X, XTSLIN-80X, XTSLIN-150X and XTSLIN-250X lines of linear
power X-band amplifiers provide the highest linear power density
solutions available while drawing very low prime power and operating in
the toughest environments. These units are designed to meet all RF
requirements in challenging X-band networks, including Wideband Global
Satellite (“WGS”) requirements and support for multi-carrier systems.
X-band is one of the most difficult satellite communications bands to
operate in because the transmit and receive bands are directly adjacent.
Xicom’s proprietary very-low leakage designs ensure that any transmit
noise or spurious signals in the receive band is attenuated and
contained to avoid disruption of the received signal, enabling
multi-carrier operation with low Passive Intermodulation (“PIM”)

These X-band SSPAs are all offered with optional built-in upconverters;
with a range of monitor and control interfaces including SNMP; and
options for redundancy or output power combining. The compact size and
high efficiency of these units provide unparalleled linear power
density, achieving 25W of linear output power (using MIL-STD-188-164
definition) with a 5.3 lb. package; and 150W linear output power with a
32 lb. package. These units operate air-cooled in -40C to +60C
temperatures and meet stringent outdoor environmental requirements per
MIL-STD-810G. “Xicom’s X-band SSPAs take advantage of the latest GaN
technology for high efficiency and power density, and also incorporate
our extensive institutional knowledge gained by developing high-power
X-band tube-based amplifiers with extremely low leakage,” commented Mark
Schmeichel, Senior Vice President, and General Manager for Comtech Xicom
Technology, Inc. “With the addition of these innovative GaN-based SSPA
products, Xicom has become a clear global leader in X-band satcom uplink

Additional information will be available to satcom integrators and
operators by visiting Comtech Xicom Technology representatives in Booth
1401, at SATELLITE 2019, May 6-9, in Washington, DC. Product information
is available on the Comtech Xicom Technology Website at

Comtech Xicom Technology, Inc., a world leader in high-power amplifiers,
manufactures a wide variety of tube-based and solid-state power
amplifiers for military and commercial satellite uplink applications.
The product range encompasses power levels from 8 W to 3 kW, with
frequency coverage in sub-bands within the 2 GHz to 52 GHz spectrum.
Amplifiers are available for fixed and ground-based, ship-board, and
airborne mobile applications. Please visit
for more information.

Comtech Telecommunications Corp. designs, develops, produces and markets
innovative products, systems and services for advanced communications
solutions. The Company sells products to a diverse customer base in the
global commercial and government communications markets.

Certain information in this press release contains statements that are
forward-looking in nature and involve certain significant risks and
uncertainties. Actual results could differ materially from such
forward-looking information. The Company’s Securities and Exchange
Commission filings identify many such risks and uncertainties. Any
forward-looking information in this press release is qualified in its
entirety by the risks and uncertainties described in such Securities and
Exchange Commission filings.


Financial Media Contact:
Michael D. Porcelain
Vice President and Chief Operating Officer
Telecommunications Corp.
Telephone: (631) 962-7000
E-mail: [email protected]

Division Media Contact:
Eric Schmidt
Vice President –
Comtech Xicom Technology, Inc.
Telephone: (408) 213-3052
[email protected]

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