Comtech Telecommunications Corp. to Participate in Landenburg Thalmann 2019 Technology Expo

MELVILLE, N.Y. –
May 17, 2019– Comtech Telecommunications Corp. (NASDAQ:CMTL) announced
today that it will participate in the Ladenburg Thalmann 2019 Technology
Expo on May 30, 2019 at the Convene meeting center in New York, NY.

Michael D. Porcelain, Senior Vice President and Chief Operating Officer,
and Michael A. Bondi, Chief Financial Officer, will be available to
provide an update on the company and its current business opportunities.
The company will also conduct one-on-one meetings with investors
throughout the day. To register for the conference and for one-on-one
meetings, please contact your Ladenburg Thalmann representative or visit https://conference.ladenburg.com/.

Comtech电信公司设计、开发、生产和销售用于先进通信的创新产品、系统和服务。
创新产品、系统和服务的先进通信解决方案。
解决方案。公司向全球商业和政府通信市场的不同客户群销售产品。
公司向全球商业和政府通信市场的不同客户群销售产品。

本新闻稿中的某些信息包含有以下陈述
本新闻稿中的某些信息包含具有前瞻性的陈述,并涉及某些重大风险和
不确定因素。实际结果可能与这些
实际结果可能与这些前瞻性信息大相径庭。公司的证券交易
委员会的文件中指出了许多这样的风险和不确定因素。本新闻稿中的任何
本新闻稿中的任何前瞻性信息都受到该证券交易委员会文件中描述的风险和不确定性的限制。
本新闻稿中的任何前瞻性信息都受到这些证券交易委员会文件中描述的风险和不确定性的限制。
证券交易委员会文件中描述的风险和不确定性。

PCMTL

Media:
Michael D. Porcelain, Senior Vice President and Chief
Operating Officer
(631) 962-7000
[email protected]

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